PCB Assembly Tests & Inspections
PCB Assembly Tests & Inspections
- DFA (Design for Assembly) Check
- Solder Paste Quality Inspection
- Visual Inspection
- Visual Inspection
- AOI (Automated Optical Inspection)
- X-ray Inspection
- Visual Inspection
- Visual Inspection
- FAI (First Article Inspection)
- ICT (In Circuit Test)
IQC (Incoming Quality Inspection)
At Gold Mate, IQC (Incoming Quality Inspection) is a critical step in our PCB assembly process. We conduct thorough inspections of each component, assessing both physical characteristics such as size, shape, color, texture, and silkscreen, as well as electrical properties like resistance, capacitance, power, and brightness. This ensures that every part used in the assembly meets the highest quality standards and adheres to required specifications, helping to prevent any potential defects or issues caused by faulty components during production.
Our rigorous IQC process also helps reduce the risk of counterfeit or substandard components entering the supply chain, ensuring the integrity of the materials we use. By implementing this strict quality control, Gold Mate guarantees that all components in our products are of the highest quality and will meet customer expectations. This commitment ensures that our products are reliable, safe, and ready for the demands of end users.
Manual Visual Inspection
we ensure the highest quality through comprehensive testing, including 100% electronic testing of our PCB bare boards, 100% Automated Optical Inspection (AOI) for component accuracy, X-ray inspection for BGA soldering, ICT (In-Circuit Testing) for electrical connections, and FCT (Functional Testing) as per customer requirements. However, we also recognize the importance of manual visual inspection.
While advanced equipment plays a crucial role, manual visual inspection is essential for detecting minor defects that automated systems may miss. This process involves checking components, solder joints, PCB assembly integrity, surface finish, and overall appearance.


